Useful Info

PCB Manufacturing Flow

The following gives a simplified step by step overview of the standard manufacturing process for a PTH PCB:

STEP 1 - FILM GENERATION Generated from gerber files, a film representation of the board layout is produced. A film is required for each 'layer' - i.e copper layers, solder resist, legend, etc.
STEP 2 - CUT RAW MATERIAL For a standard PTH board, double sided copper clad FR4 would be used, typically 1.6mm thick.
STEP 3 - DRILL HOLES Drill hole pattern using NC drill machines.
STEP 4 - COPPER PLATING Apply copper plating in hole barrels.
STEP 5 - APPLY IMAGE Apply photosensitive dry film (plate resist) to panel. Use UV light source and film to expose panel. Develop selected areas from panel.
STEP 6 - PATTERN PLATE Electrochemical process to build copper in the holes and on the trace area.
STEP 7 - ETCH & STRIP Remove dry film then etch exposed copper.
STEP 8 - SOLDER MASK Apply solder mask area to entire board with the exception of solder pads.
STEP 9 - BOARD FINISH Apply HASL (Hot Air Solder Levelling). Hot air knives level the solder. Alternative finishes such as nickel gold available.
STEP 10 - LEGEND Apply component idents using silk screen printing process.
STEP 11 - ATE Continuity testing.
STEP 12 - FABRICATION Route the perimeter of the board using NC router.